智能熱交換器控制器軟件設(shè)計(jì)

電氣自動(dòng)化論文編號(hào):ZD1033    論文字?jǐn)?shù):10139,頁(yè)數(shù):43

目  錄
摘  要 I
Abstract II
1  前 言 1
1.1  選題背景 1
1.2  選題意義 1
1.3  主要研究?jī)?nèi)容 1
2  總體方案設(shè)計(jì) 2
2.1  系統(tǒng)設(shè)計(jì)要求 2
2.2  系統(tǒng)設(shè)計(jì)分工 3
2.3  系統(tǒng)硬件結(jié)構(gòu) 3
2.4  系統(tǒng)總體軟件流程 4
3  PIC單片機(jī)簡(jiǎn)介 5
3.1  PIC16F77單片機(jī) 5
3.1.1  單片機(jī)引腳 5
3.2  特殊功能寄存器 7
3.2.1  狀態(tài)寄存器STATUS 7
3.2.2  選項(xiàng)寄存器OPTION_REG 8
4  PIC指令與匯編語(yǔ)言 10
4.1  PIC指令系統(tǒng) 10
4.1.1  數(shù)據(jù)傳送類指令 10
4.1.2  算術(shù)運(yùn)算類指令 11
4.1.3  邏輯運(yùn)算類指令 11
4.1.4  控制轉(zhuǎn)移類指令 12
4.2  匯編語(yǔ)言 13
5  系統(tǒng)軟件設(shè)計(jì) 14
5.1  顯示模塊 14
5.1.1  鍵盤掃描 14
5.2  溫度控制模塊 20
5.2.1  目標(biāo)溫度控制 21
5.2.2  A/D轉(zhuǎn)換 22
5.3  調(diào)速模塊 25
5.3.1  PWM技術(shù)簡(jiǎn)述 26
5.3.2  PWM調(diào)速 26
6  MAPLAB的使用與調(diào)試 28
6.1  MAPLAB簡(jiǎn)介 28
6.2  MAPLAB使用 28
6.2.1  MAPLAB編譯 28
6.2.2  編譯錯(cuò)誤 29
6.3  硬件調(diào)試 30
7  總  結(jié) 31
致 謝 32
參考文獻(xiàn) 33
附錄1  系統(tǒng)單片機(jī)程序 34

摘  要
 熱交換器的工作原理為依靠新風(fēng)和排風(fēng)的溫差和蒸汽分壓力差通過(guò)全熱交換用紙來(lái)達(dá)到熱濕交換，回收排風(fēng)的能量對(duì)新風(fēng)進(jìn)行夏季預(yù)冷除濕、冬季預(yù)熱加濕，從而達(dá)到節(jié)能的目的，與其他能量回收裝置相比的最大優(yōu)點(diǎn)是新風(fēng)和排風(fēng)不會(huì)發(fā)生交叉污染，結(jié)構(gòu)緊湊，壓力損失小。
 本次畢業(yè)設(shè)計(jì)包括溫度控制模塊和顯示模塊，其中溫度控制模塊主要通過(guò)Microchip公司生產(chǎn)的PIC芯片對(duì)外接設(shè)備如加熱器、熱交換器和空調(diào)的通斷控制來(lái)維持基站內(nèi)的環(huán)境溫度；顯示模塊是通過(guò)兩片三位的數(shù)碼管、五個(gè)運(yùn)行燈及一個(gè)報(bào)警燈來(lái)顯示工作狀態(tài)和室內(nèi)外溫度等參數(shù)的。程序由PIC匯編語(yǔ)言實(shí)現(xiàn)，并使用MAPLAB IDE編譯器進(jìn)行程序的編譯。最終進(jìn)行與硬件和上位機(jī)相連，進(jìn)行調(diào)試。

關(guān)鍵詞：PIC單片機(jī)、熱交換器、溫度控制
 Abstract
The working principle of heat exchanger is:rely on the fresh air and exhaust air temperature and vapor pressure difference,achieve the exchange of heat and moisture through heat exchange, recover exhaust energy, precooling and dehumidify in summer and preheating and humidify in winter to fresh air, so as to achieve the purpose of energy saving. Compared with other energy recovery units, the biggest advantage is:fresh air and exhaust cross-contamination don't occur cross contamination, compact structure, and small pressure loss.
The graduation design includes: Temperature control module and display module. Thereinto, temperature control module mainly maintenance ambient temperature within base station through PIC chip producted by Microchip controls the external devices on-off,such as heaters, heat exchangers and air-conditioning. Display module show the work state, the in/out temperature and other parameters through 2 digital control of three, five runs and a warning lamp lights. Procedure is carried out by PIC assembly language, then is complied by using MAPLAB IDE compiler. Eventually connect the hardware and host computer and debug.
Keywords：PICmicro-control unit,Heat exchangers, temperature control