低含氧量銀銅焊料的研究

材料科學論文編號:CL117  論文字數:14714,頁數:26

目   錄
中文摘要......................................................................Ⅰ
英文摘要......................................................................Ⅱ
第一章  緒論...................................................................1
 1.1  研究的背景...........................................................1-2
 1.2  本次研究的內容和意義．．．．．．．．．．．．．．．．．．．．．．．．．．．．.....2
第二章  釬料及釬料加工工藝.....................................................3
 2.1  釬焊的方法和原則.......................................................3
 2.2  釬料的構成及分類.....................................................3-4
 2.3  釬劑、釬料的選擇與搭配................................................4-6
 2.4  釬焊工藝的研究.......................................................6-8
第三章  銀銅焊料低含氧量的制粉設計.............................................9
 3.1  快速凝固技術-粉末冶金技術的發展概況....................................9
 3.2  快速凝固技術-雙流霧化法.............................................9-11
第四章  低含氧量銀銅焊粉BAg72Cu...............................................12
 4.1  低含氧量銀銅焊粉的概述................................................12
 4.2  低含氧量銀銅焊粉BAg72Cu的研制......................................12-14
 4.3  低含氧量銀銅焊粉BAg72Cu的性能測試及微觀分析........................14-16
第五章  低含氧量銀銅焊粉在陶瓷與金屬焊接中的應用..............................17
 5.1  陶瓷焊接的概述........................................................17
 5.2  陶瓷與金屬的釬焊工藝...............................................17-20
 5.3  氧化物陶瓷與金屬釬焊連接過程..........................................20
第六章  結論..................................................................21
參考文獻......................................................................22
致謝..........................................................................23

 摘要
 
 銀銅焊料是Ag-Cu二元合金的共晶組織成分，其熔點適中，工藝性好，并具有良好的強度、韌性、導電性、導熱性和抗腐蝕性，在電真空開關、斷路器、陶瓷焊接等方面都極具應用性。
 本文對低含氧量銀銅焊料的潤濕性及濺散性進行了分析，并對制粉工藝進行探討，并通過其在陶瓷工業上的應用，對其性能進行了詳細分析。

關鍵詞：銀銅焊料 潤濕性 濺散性 陶瓷 制粉工藝

Abstract

 Ag-Cu filler is a binary alloy Ag-Cu eutectic composition. Silver-based filler has medium melting point, with good technology, good strength, toughness, electrical conductivity, thermal conductivity and corrosion resistance. Especially for the highly application in the power vacuum switcs, circuit breakers, ceramic welding,ect.
 This passage puts forward the impact of oxygen levels in Ag-Cu filler on wettability and sputter of filler, and explore to Manufacture of powder technology，through its application in the ceramic industry，We get the detailed performance analysis. 

 Key Words: Silver-based Filler；Wettability；Sputter；Ceramics ；Manufacture of Powder Technology